The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2023

Filed:

Aug. 11, 2021
Applicant:

Faraday Technology, Inc., Englewood, OH (US);

Inventors:

Timothy D. Hall, Englewood, OH (US);

Holly M. Garich, Fairborn, OH (US);

Heather McCrabb, Kettering, OH (US);

Earl Jennings Taylor, Troy, OH (US);

Assignee:

Faraday Technology, Inc., Englewood, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25F 3/16 (2006.01); C25F 7/00 (2006.01); B33Y 40/20 (2020.01); B22F 10/25 (2021.01); B22F 10/28 (2021.01);
U.S. Cl.
CPC ...
C25F 3/16 (2013.01); B33Y 40/20 (2020.01); C25F 7/00 (2013.01); B22F 10/25 (2021.01); B22F 10/28 (2021.01);
Abstract

A method of and system for surface finishing an additive manufactured part. A part having a surface roughness with macroasperities is placed in a chamber with an electrolyte and an electrode. A pulse/pulse reverse power supply is connected to the part rendering it anodic and connected to the electrode rendering it cathodic. The power supply is operated to decrease the surface roughness of the part by applying a first series of waveforms including at least two waveforms where a diffusion layer is maintained at a thickness to produce a macroprofile regime relative to the macroasperities, the first series of waveforms having anodic voltages applied for anodic time periods before cathodic voltages applied for cathodic time periods to effect part surface smoothing to a first surface roughness with minimal material removal and applying a final waveform where the diffusion layer represents a microprofile regime, the final waveform having a final anodic voltage applied for a final anodic time period before a final cathodic voltage applied for a final cathodic time period to effect part surface smoothing to a final surface roughness with minimal material removal.


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