The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2023

Filed:

Sep. 06, 2019
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Ju Hyeong Lee, Daejeon, KR;

Byoung Il Kang, Daejeon, KR;

Seo Hwa Kim, Daejeon, KR;

Sejin Han, Daejeon, KR;

Seongkyun Kim, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 55/02 (2006.01); B29C 45/00 (2006.01); C08L 83/04 (2006.01); B29K 55/02 (2006.01); B29K 83/00 (2006.01); C08K 5/01 (2006.01); C08K 5/315 (2006.01);
U.S. Cl.
CPC ...
C08L 55/02 (2013.01); B29C 45/0001 (2013.01); C08L 83/04 (2013.01); B29K 2055/02 (2013.01); B29K 2083/00 (2013.01); C08K 5/01 (2013.01); C08K 5/315 (2013.01);
Abstract

A thermoplastic resin composition includes 100 parts by weight of a base resin including 5 to 40% by weight of a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound graft copolymer (a) containing conjugated diene rubber having a particle diameter of 0.05 μm to 0.2 μm, 5 to 40% by weight of a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound graft copolymer (b) containing conjugated diene rubber having a particle diameter of greater than 0.2 μm and less than or equal to 0.5 μm, and 50 to 80% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer (c); and more than 0.01 parts by weight and less than 2 parts by weight of a compound having a kinematic viscosity (25° C.) greater than 5 cSt and less than 200 cSt. The resin composition has excellent plating characteristics.


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