The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2023

Filed:

Feb. 05, 2018
Applicant:

SK Microworks Co., Ltd., Gyeonggi-do, KR;

Inventors:

Dawoo Jeong, Gyeonggi-do, KR;

Sunhwan Kim, Incheon, KR;

Jin Woo Lee, Gyeonggi-do, KR;

Dae Seong Oh, Seoul, KR;

Dong Jin Lim, Gyeonggi-do, KR;

Assignee:

SKC microworks CO., LTD., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/18 (2006.01); C08G 73/14 (2006.01); B29C 39/24 (2006.01); B29C 39/38 (2006.01); B29C 39/42 (2006.01); B29C 39/44 (2006.01); C08G 73/10 (2006.01); C08L 79/08 (2006.01); B29C 41/00 (2006.01); B29K 77/00 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
C08J 5/18 (2013.01); B29C 39/24 (2013.01); B29C 39/38 (2013.01); B29C 39/42 (2013.01); B29C 39/44 (2013.01); C08G 73/1039 (2013.01); C08G 73/14 (2013.01); C08L 79/08 (2013.01); B29C 41/003 (2013.01); B29K 2077/00 (2013.01); B29K 2105/0094 (2013.01); C08J 2379/08 (2013.01); C08L 2201/10 (2013.01); C08L 2203/16 (2013.01);
Abstract

An embodiment can provide a polyamide-imide film, which has particular punching properties, is colorless and transparent and has excellent mechanical properties and optical properties, and a method for preparing same. The polyamide-imide film comprises a polyamide-imide polymer, which is formed by means of polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, and satisfies the condition of general formula (1) below. General formula (1) 4≤X/Y≤12 X: the maximum hole diameter (mm) comprising cracks when the film is punched at 10 mm/min using a 2.5 mm spherical tip by means of a UTM compression mode Y: the modulus (GPa) of the film.


Find Patent Forward Citations

Loading…