The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2023
Filed:
Mar. 26, 2020
Applicant:
Shikoku Chemicals Corporation, Kagawa, JP;
Inventors:
Akihito Otsuka, Kagawa, JP;
Takashi Kashiwabara, Kagawa, JP;
Kazunori Aoki, Kagawa, JP;
Takeshi Kumano, Kagawa, JP;
Assignee:
SHIKOKU CHEMICALS CORPORATION, Kagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); C08G 65/48 (2006.01); C08J 5/24 (2006.01); B32B 15/085 (2006.01); B32B 15/092 (2006.01); B32B 27/32 (2006.01); B32B 27/38 (2006.01); C08G 65/44 (2006.01); C08K 5/3492 (2006.01); C09J 171/12 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08G 65/485 (2013.01); B32B 15/085 (2013.01); B32B 15/092 (2013.01); B32B 27/32 (2013.01); B32B 27/38 (2013.01); C08G 65/44 (2013.01); C08J 5/24 (2013.01); C08J 5/249 (2021.05); C08K 5/34924 (2013.01); C09J 171/12 (2013.01); H05K 1/0346 (2013.01); B32B 2307/204 (2013.01); B32B 2307/408 (2013.01); B32B 2457/08 (2013.01);
Abstract
This invention provides a material having a low dissipation factor that is suitable for use as an insulating material for a printed wiring board and the like; a resin composition used for the production of the material; and an application using the material. The present invention relates to a resin composition comprising a mono(C-Calkyl)diallyl isocyanurate and a polyphenylene ether resin; a cured product of the resin composition; and use of the cured product.