The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2023
Filed:
Jun. 28, 2019
Applicant:
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Inventors:
Shohei Yamaguchi, Tokyo, JP;
Katsuya Tomizawa, Tokyo, JP;
Norihiro Shida, Tokyo, JP;
Hidetoshi Kawai, Tokyo, JP;
Assignee:
MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/50 (2006.01); B32B 15/14 (2006.01); H05K 1/03 (2006.01); B32B 5/02 (2006.01); C08G 59/24 (2006.01); C08G 59/68 (2006.01); C08J 5/24 (2006.01); B32B 5/26 (2006.01); B32B 15/20 (2006.01); C08G 59/40 (2006.01); C08G 59/62 (2006.01);
U.S. Cl.
CPC ...
C08G 59/5073 (2013.01); B32B 5/024 (2013.01); B32B 5/263 (2021.05); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08G 59/245 (2013.01); C08G 59/4042 (2013.01); C08G 59/621 (2013.01); C08G 59/686 (2013.01); C08J 5/244 (2021.05); C08J 5/249 (2021.05); H05K 1/0373 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2264/1021 (2020.08); B32B 2457/08 (2013.01); C08J 2363/00 (2013.01); C08J 2461/04 (2013.01); C08J 2479/08 (2013.01); H05K 2201/0209 (2013.01);
Abstract
A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.