The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2023

Filed:

Dec. 15, 2020
Applicant:

The Procter & Gamble Company, Cincinnati, OH (US);

Inventors:

Stephan Gary Bush, Liberty Township, OH (US);

Ted De Castro, Newton, MA (US);

Gayle Marie Frankenbach, Cincinnati, OH (US);

Dana Paul Gruenbacher, Fairfield, OH (US);

Kenneth Lee Morand, Maineville, OH (US);

Thomas Elliot Rabe, Baltimore, MD (US);

Faiz Feisal Sherman, Mason, OH (US);

Nicola John Policicchio, Mason, OH (US);

Philip Andrew Sawin, Cincinnati, OH (US);

Jeremy Michael Carter, Union, KY (US);

Assignee:

The Procter & Gamble Company, Cincinnati, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A47L 13/26 (2006.01); A61L 2/18 (2006.01); B05D 1/02 (2006.01); B05C 17/005 (2006.01); H04N 1/62 (2006.01); G06T 7/90 (2017.01); C11D 3/39 (2006.01); C11D 3/37 (2006.01); C11D 11/00 (2006.01); B05D 1/42 (2006.01);
U.S. Cl.
CPC ...
B05C 17/0052 (2013.01); A47L 13/26 (2013.01); A61L 2/18 (2013.01); B05C 17/00503 (2013.01); C11D 3/3723 (2013.01); C11D 3/3902 (2013.01); C11D 11/0023 (2013.01); G06T 7/90 (2017.01); H04N 1/628 (2013.01); A61L 2202/14 (2013.01); A61L 2202/15 (2013.01); B05D 1/02 (2013.01); B05D 1/42 (2013.01); G06T 2207/10024 (2013.01);
Abstract

A device and method for applying a material to a hard surface. The device has a sensor and one or more applicator nozzles. The device further includes a reservoir for containing a material to be deposited, and a CPU. The method includes providing information from the sensor about the surface to the CPU, which uses the information to identify where the material is to be deposited and/or how much to deposit.


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