The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2023
Filed:
Oct. 08, 2019
Applicant:
Vactronix Scientific, Llc, Fremont, CA (US);
Inventors:
Assignee:
Vactronix Scientific, LLC., San Antonio, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/36 (2014.01); C03C 14/00 (2006.01); A61F 2/915 (2013.01); B21D 51/16 (2006.01); A61F 2/91 (2013.01); B23K 26/362 (2014.01); C23C 14/00 (2006.01); C23C 14/04 (2006.01); C23C 14/58 (2006.01); A61L 31/02 (2006.01); C30B 33/10 (2006.01); B23K 101/06 (2006.01); A61L 31/08 (2006.01);
U.S. Cl.
CPC ...
A61F 2/915 (2013.01); A61F 2/91 (2013.01); A61L 31/022 (2013.01); B21D 51/16 (2013.01); B23K 26/36 (2013.01); B23K 26/362 (2013.01); C23C 14/0005 (2013.01); C23C 14/04 (2013.01); C23C 14/5873 (2013.01); C30B 33/10 (2013.01); A61F 2210/0076 (2013.01); A61F 2230/0054 (2013.01); A61F 2240/001 (2013.01); A61L 31/028 (2013.01); A61L 31/088 (2013.01); A61L 2420/02 (2013.01); B23K 2101/06 (2018.08);
Abstract
An intravascular stent and method of making an intervascular stent having a hybrid pattern a. The hybrid pattern comprises a plurality of circumferentially self-expansible members comprising a plurality of interconnected, geometrically deformable closed cells, adjacent self-expansible members interconnected by a plurality of bridge members linking a first interconnection between two closed cells in a first self-expansible member to a second interconnection between two closed cells in a second self-expansible member, wherein the second interconnection is circumferentially offset and non-adjacent to the first interconnection.