The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2023

Filed:

Apr. 09, 2021
Applicant:

K2m, Inc., Leesburg, VA (US);

Inventors:

Patrick Melton, Seattle, WA (US);

Michael Prosser, Mount Pleasant, SC (US);

Assignee:

K2M, Inc., Leesburg, VA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 17/70 (2006.01); A61B 34/10 (2016.01); A61F 2/30 (2006.01); A61F 2/44 (2006.01); A61B 17/86 (2006.01); B29C 64/393 (2017.01); B29C 64/153 (2017.01); B33Y 50/02 (2015.01); B33Y 70/00 (2020.01); B22F 7/06 (2006.01); A61B 17/80 (2006.01); B22F 10/00 (2021.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); A61B 17/00 (2006.01); B29L 31/00 (2006.01); B22F 10/14 (2021.01); B22F 10/25 (2021.01); B22F 10/28 (2021.01); B22F 10/68 (2021.01); B22F 12/00 (2021.01); B22F 10/40 (2021.01); B22F 10/80 (2021.01); B22F 10/60 (2021.01); B22F 10/64 (2021.01); B22F 10/66 (2021.01);
U.S. Cl.
CPC ...
A61B 17/7035 (2013.01); A61B 17/7032 (2013.01); A61B 17/7037 (2013.01); A61B 17/7049 (2013.01); A61B 17/80 (2013.01); A61B 17/86 (2013.01); A61B 34/10 (2016.02); A61F 2/30942 (2013.01); A61F 2/442 (2013.01); A61F 2/4455 (2013.01); B22F 7/06 (2013.01); B22F 10/00 (2021.01); B29C 64/153 (2017.08); B29C 64/393 (2017.08); B33Y 50/02 (2014.12); B33Y 70/00 (2014.12); A61B 2017/00526 (2013.01); A61B 2034/108 (2016.02); A61F 2002/3085 (2013.01); A61F 2002/30578 (2013.01); A61F 2002/30787 (2013.01); A61F 2002/30952 (2013.01); A61F 2002/30971 (2013.01); A61F 2002/30985 (2013.01); B22F 10/14 (2021.01); B22F 10/25 (2021.01); B22F 10/28 (2021.01); B22F 10/40 (2021.01); B22F 10/60 (2021.01); B22F 10/64 (2021.01); B22F 10/66 (2021.01); B22F 10/68 (2021.01); B22F 10/80 (2021.01); B22F 12/38 (2021.01); B29L 2031/753 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12);
Abstract

A method of manufacturing a surgical implant includes simultaneously forming a first component and a second component of the surgical implant. Formation of the first and second components includes depositing a first quantity of material to a building platform and fusing the first quantity of material to form a first layer of the first and second components. The method of manufacturing also includes depositing a second quantity of material over the first layer of the first and second components and fusing the second quantity of material to form a second layer of the first and second components. The surgical implant is fully assembled upon the completion of the formation of the first and second components.


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