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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11700774 B1

PDFFull Text
Date of Patent:
Jul. 11, 2023

Filed:

Nov. 03, 2020

Circuit module

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Koichiro Kawasaki, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Bryan P Gordon

Int. Cl.
CPC ...
H01L 27/20 (2006.01); H10N 39/00 (2023.01); H03H 9/10 (2006.01); H03H 9/05 (2006.01); H10N 30/87 (2023.01); H10N 30/88 (2023.01); H01L 23/00 (2006.01); H01L 49/02 (2006.01); H03H 9/145 (2006.01);
U.S. Cl.
CPC ...
H10N 39/00 (2023.02); H01L 24/16 (2013.01); H01L 28/10 (2013.01); H03H 9/058 (2013.01); H03H 9/059 (2013.01); H03H 9/0542 (2013.01); H03H 9/1071 (2013.01); H03H 9/145 (2013.01); H10N 30/87 (2023.02); H10N 30/88 (2023.02); H01L 2924/19042 (2013.01);
Abstract

A circuit module includes a mounting substrate including a conductor wiring, an elastic wave element provided in or on a main surface of the mounting substrate, an electric element provided in or on the main surface, the electric element being different from the elastic wave element, and an insulating resin portion provided in or on the main surface to cover the elastic wave element and the electric element. The elastic wave element and the electric element are connected to each other by the conductor wiring. A height of the elastic wave element is about 0.28 mm or less, which is less than that of the electric element. The thickness of the resin portion in a region in which the resin portion covers the elastic wave element is greater than the thickness of the resin portion in a region in which the resin portion covers the electric element.

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