The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2023

Filed:

Jan. 14, 2022
Applicant:

Lg Display Co., Ltd., Seoul, KR;

Inventors:

Sang Hyuk Won, Gimpo-si, KR;

Min Joo Kim, Seoul, KR;

Jae Won Lee, Goyang-si, KR;

Sang Hoon Pak, Seoul, KR;

Byong Hoo Kim, Paju-si, KR;

Sang Heun Lee, Seoul, KR;

Hyang Myoung Gwon, Paju-si, KR;

Jeong Hoon Lee, Gimpo-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 59/40 (2023.01); G06F 3/041 (2006.01); G06F 3/044 (2006.01); H10K 59/38 (2023.01); H10K 59/131 (2023.01); G09G 3/3241 (2016.01); H10K 50/81 (2023.01); H10K 50/82 (2023.01);
U.S. Cl.
CPC ...
H10K 59/40 (2023.02); G06F 3/044 (2013.01); G06F 3/0412 (2013.01); G06F 3/0443 (2019.05); G06F 3/0446 (2019.05); G09G 3/3241 (2013.01); H10K 50/81 (2023.02); H10K 50/82 (2023.02); H10K 59/131 (2023.02); H10K 59/38 (2023.02); G06F 2203/04103 (2013.01); G06F 2203/04111 (2013.01); G06F 2203/04112 (2013.01);
Abstract

Disclosed is a display device capable of reducing the thickness and the weigh thereof. In an organic light-emitting diode display device having a touch sensor, a plurality of routing lines, which are connected respectively to a plurality of touch sensors disposed on an encapsulation unit, are disposed on different planes so as to overlap each other and are electrically connected to each other through a plurality of routing contact holes. Thereby, a connection fault between the routing lines is prevented. In addition, through the provision of the touch sensors above the encapsulation unit, a separate attachment process is unnecessary, which results in a simplified manufacturing process and reduced costs.


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