The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2023
Filed:
Aug. 05, 2022
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Chung-Hyo Jung, Suwon-si, KR;
Kang-Sik Kim, Suwon-si, KR;
Young-San Kim, Suwon-si, KR;
Won-Min Kim, Yongin-si, KR;
Chi-Hyun Cho, Yongin-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/552 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20436 (2013.01); H01L 23/552 (2013.01); H05K 1/0209 (2013.01); H05K 1/181 (2013.01); H05K 7/205 (2013.01); H05K 9/00 (2013.01); H05K 9/0024 (2013.01); H05K 2201/064 (2013.01);
Abstract
According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.