The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2023

Filed:

Sep. 09, 2021
Applicant:

Meta Platforms Technologies, Llc, Menlo Park, CA (US);

Inventors:

Scott Porter, Woodinville, WA (US);

Chuming Zhao, Redmond, WA (US);

Antonio John Miller, Woodinville, WA (US);

Peter Daniel Clyde, Kennewick, WA (US);

Assignee:

Meta Platforms Technologies, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01); H04R 9/06 (2006.01); H01F 7/08 (2006.01); H01F 7/126 (2006.01); H04R 9/02 (2006.01); H04R 19/02 (2006.01);
U.S. Cl.
CPC ...
H04R 9/06 (2013.01); H01F 7/081 (2013.01); H01F 7/126 (2013.01); H04R 9/025 (2013.01); H04R 19/02 (2013.01); H04R 2201/003 (2013.01); H04R 2460/13 (2013.01);
Abstract

A microelectromechanical system (MEMS) coil assembly is presented herein. In some embodiments, the MEMS coil assembly includes a foldable substrate and a plurality of coil segments. Each coil segment includes a portion of the substrate, two conductors arranged on the portion of the substrate. The substrate can be folded to stack the coil segments on top of each other and to electrically connect first and second conductors of adjacent coil segments. In some other embodiments, the MEMS coil assembly includes a plurality of coil layers stacked onto each other. Each coil layer includes a substrate and a conductor to form a coil. The conductors of adjacent coil layers are connected through a via. The MEMS coil assembly can be arranged between a pair of magnets. An input signal can be applied to the MEMS coil assembly to cause the MEMS coil assembly to move orthogonally relative to the magnets.


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