The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2023

Filed:

May. 23, 2019
Applicant:

GM Global Technology Operations Llc, Detroit, MI (US);

Inventors:

Hongliang Wang, Sterling Heights, MI (US);

James G. Schroth, Troy, MI (US);

Matthew T. Vanderlip, Windsor, CA;

Edwin H. Chang, Auburn Hills, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 15/00 (2006.01); B33Y 10/00 (2015.01); B29C 64/112 (2017.01); H02K 15/02 (2006.01); B22F 7/08 (2006.01); B22F 10/28 (2021.01); B33Y 80/00 (2015.01); B33Y 40/00 (2020.01); H02K 1/18 (2006.01); H01R 43/16 (2006.01); H01R 43/20 (2006.01); H01R 43/24 (2006.01); H02K 1/12 (2006.01);
U.S. Cl.
CPC ...
H02K 15/0062 (2013.01); B22F 7/08 (2013.01); B22F 10/28 (2021.01); B29C 64/112 (2017.08); H02K 15/0056 (2013.01); H02K 15/0068 (2013.01); H02K 15/02 (2013.01); B33Y 10/00 (2014.12); B33Y 40/00 (2014.12); B33Y 80/00 (2014.12); H01R 43/16 (2013.01); H01R 43/20 (2013.01); H01R 43/24 (2013.01); H02K 1/12 (2013.01); H02K 1/18 (2013.01); H02K 1/187 (2013.01); H02K 2203/09 (2013.01); H02K 2203/12 (2013.01);
Abstract

A method for manufacturing an electro-mechanical device includes creating a plurality of substrates using a first additive manufacturing process. Each of the substrates includes a polymeric material. The substrates include a first substrate and a second substrate. The first substrate includes a first main body and defines a protrusion extending from the first main body. The second substrate includes a second main body and a recess defined in the second main body. The method includes coupling the first substrate to the second substrate by inserting the protrusion into the recess such that the protrusion elastically deforms to an elastically averaged configuration. The protrusion and the recess together form an elastic averaging coupling. The method includes creating a plurality of electrically conductive components using a second additive manufacturing process and then coupling the electrically conductive components to at least one of the substrates.


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