The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2023

Filed:

Feb. 19, 2021
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Kyung In Kang, Suwon-si, KR;

Jeong Ki Ryoo, Suwon-si, KR;

Kyu Bum Han, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 9/04 (2006.01); H01Q 1/22 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01Q 21/06 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/0457 (2013.01); H01L 23/49827 (2013.01); H01L 23/66 (2013.01); H01L 24/13 (2013.01); H01L 24/73 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/2291 (2013.01); H01Q 21/065 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/1421 (2013.01);
Abstract

An antenna module includes a ground layer including a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via; a coupling patch pattern spaced apart from the patch antenna pattern; a first dielectric layer to accommodate the patch antenna pattern and the coupling patch pattern; a second dielectric layer to accommodate at least a portion of the feed via and the ground layer; and electrical connection structures disposed between the first dielectric layer and the second dielectric layer to separate the first dielectric layer from the second dielectric layer.


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