The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2023
Filed:
Apr. 26, 2022
Applicant:
Meta Platforms Technologies, Llc, Menlo Park, CA (US);
Inventors:
Chloe Astrid Marie Fabien, Seattle, WA (US);
Michael Grundmann, Kirkland, WA (US);
Assignee:
META PLATFORMS TECHNOLOGIES, LLC, Menlo Park, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/62 (2010.01); G09G 3/32 (2016.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/0095 (2013.01); G09G 3/32 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract
Disclosed herein are techniques for forming a thin-film circuit layer on an array of light-emitting diodes (LEDs). LEDs in the array of LEDs can be singulated by various processes, such as etching and ion implantation. Singulating LEDs can be performed before or after forming the thin-film circuit layer on the array of LEDs. The array of LEDs can be bonded to a transparent or non-transparent substrate.