The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2023
Filed:
Aug. 26, 2020
Applicant:
Kioxia Corporation, Tokyo, JP;
Inventors:
Takayuki Beppu, Yokkaichi Mie, JP;
Masayuki Kitamura, Yokkaichi Mie, JP;
Hiroshi Toyoda, Yokkaichi Mie, JP;
Katsuaki Natori, Yokkaichi Mie, JP;
Assignee:
KIOXIA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 21/28 (2006.01); H01L 29/49 (2006.01); H10B 43/27 (2023.01);
U.S. Cl.
CPC ...
H01L 29/42372 (2013.01); H01L 21/28079 (2013.01); H01L 29/495 (2013.01); H10B 43/27 (2023.02);
Abstract
According to at least one embodiment, a semiconductor device includes a plurality of insulating films adjacent to each other. A conductive film is provided between the plurality of insulating films. The conductive film includes molybdenum having a grain diameter substantially the same as a distance from an upper surface to a lower surface of the conductive film.