The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2023

Filed:

Mar. 01, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventor:

Jungpil Lee, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/02 (2006.01); H01L 23/522 (2006.01); H01L 23/48 (2006.01); G06F 30/392 (2020.01);
U.S. Cl.
CPC ...
H01L 27/0207 (2013.01); H01L 23/481 (2013.01); H01L 23/5223 (2013.01); G06F 30/392 (2020.01);
Abstract

A semiconductor device includes a first integrated circuit and a second integrated circuit disposed on a semiconductor substrate and spaced apart from each other. A wiring structure is disposed on the semiconductor substrate and electrically connects the first integrated circuit and the second integrated circuit. A first TSV area and a second TSV area are disposed between the first integrated circuit and the second integrated circuit The first and second TSV areas include a plurality of first and second TSV structures penetrating through the semiconductor substrate, respectively. The wiring structure passes between the first TSV area and the second TSV area.


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