The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2023
Filed:
Jun. 30, 2020
Applicant:
Openlight Photonics, Inc., Goleta, CA (US);
Inventors:
Roberto Marcoccia, San Jose, CA (US);
Benjamin M. Curtin, Santa Barbara, CA (US);
Assignee:
OpenLight Photonics, Inc., Goleta, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B41F 16/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); B41F 16/0046 (2013.01); B41F 16/0073 (2013.01); H01L 24/97 (2013.01);
Abstract
Described herein is a die-to-wafer bonding process that utilizes micro-transfer printing to transfer die from a source wafer onto an intermediate handle wafer. The resulting intermediate handle wafer structure can then be bonded die-down onto the target wafer, followed by removal of only the intermediate handle wafer, leaving the die in place bonded to the target wafer.