The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2023

Filed:

Jun. 26, 2020
Applicant:

Lg Display Co., Ltd., Seoul, KR;

Inventors:

Hyunju Jung, Seoul, KR;

Eunah Kim, Seosan-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/56 (2006.01); G09F 9/30 (2006.01); H10K 50/844 (2023.01); H10K 59/121 (2023.01); H10K 59/131 (2023.01); H10K 71/00 (2023.01); H10K 59/12 (2023.01); H10K 102/10 (2023.01);
U.S. Cl.
CPC ...
G09F 9/301 (2013.01); H10K 50/844 (2023.02); H10K 59/121 (2023.02); H10K 59/131 (2023.02); H10K 71/00 (2023.02); H10K 59/1201 (2023.02); H10K 2102/101 (2023.02);
Abstract

In the stretchable display device of the present disclosure, peeling and delamination of connection lines between adjacent circuits mounted on individual fixed substrates that might occur during stretching is reduced. According to one embodiment of the stretchable display device, the steepness of a slope in step in an insulating layer in contact with connection lines is reduced, which prevents delamination. A plurality of individual substrates are disposed on the lower substrate and located in the active area on the lower substrate. The modulus of elasticity of the individual substrates is significantly higher than the modulus of elasticity of the lower substrate. There is a first inorganic layer positioned on each of the plurality of individual substrates, the first inorganic layer having a sidewall surface extending upward from the first substrate. A organic layer is deposited overlying the first inorganic layer, including overlying the sidewall surface of the first inorganic layer. An electrical connection line is on the organic layer and not in contact with any part of the inorganic layer, providing the additional adhesion and thus preventing delamination of the electrical connection lines from the substrate.


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