The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2023

Filed:

Jul. 14, 2022
Applicant:

Openlight Photonics, Inc., Goleta, CA (US);

Inventors:

Jonathan Edgar Roth, San Francisco, CA (US);

Erik Norberg, Santa Barbara, CA (US);

Assignee:

OpenLight Photonics, Inc., Goleta, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/025 (2006.01); G02F 1/017 (2006.01); G02F 1/00 (2006.01); G02B 6/12 (2006.01); G02F 1/01 (2006.01); G02B 6/136 (2006.01); G02B 6/122 (2006.01); B82Y 20/00 (2011.01); H01L 31/0352 (2006.01); H01L 31/024 (2014.01);
U.S. Cl.
CPC ...
G02F 1/025 (2013.01); G02B 6/12002 (2013.01); G02B 6/1228 (2013.01); G02B 6/136 (2013.01); G02F 1/0018 (2013.01); G02F 1/0121 (2013.01); G02F 1/0147 (2013.01); G02F 1/01708 (2013.01); B82Y 20/00 (2013.01); G02B 2006/12061 (2013.01); G02B 2006/12078 (2013.01); G02B 2006/12142 (2013.01); G02B 2006/12195 (2013.01); H01L 31/024 (2013.01); H01L 31/035209 (2013.01);
Abstract

A device, such as an electroabsorption modulator, can modulate a light intensity by controllably absorbing a selectable fraction of the light. The device can include a substrate. A waveguide positioned on the substrate can guide light. An active region positioned on the waveguide can receive guided light from the waveguide, absorb a fraction of the received light, and return a complementary fraction of the received light to the waveguide. Such absorption produces heat, mostly at an input portion of the active region. The input portion of the active region can be thermally coupled to the substrate, which can dissipate heat from the input portion, and can help avoid thermal runaway of the device. The active region can be thermally isolated from the substrate away from the input portion, which can maintain a relatively low thermal mass for the active region, and can increase efficiency when heating the active region.


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