The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2023
Filed:
Aug. 25, 2020
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Atsushi Saito, Chino, JP;
Assignee:
SEIKO EPSON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 7/00 (2021.01); G02B 5/32 (2006.01); G03H 1/02 (2006.01); G02B 27/01 (2006.01); G03H 1/22 (2006.01); G03H 1/00 (2006.01); G03H 1/18 (2006.01);
U.S. Cl.
CPC ...
G02B 7/008 (2013.01); G02B 5/32 (2013.01); G02B 27/0172 (2013.01); G03H 1/0005 (2013.01); G03H 1/0272 (2013.01); G03H 1/181 (2013.01); G03H 1/2202 (2013.01); G02B 2027/0174 (2013.01); G02B 2027/0178 (2013.01); G03H 2001/0088 (2013.01); G03H 2001/2231 (2013.01); G03H 2270/14 (2013.01); G03H 2270/21 (2013.01);
Abstract
An optical element includes a hologram layer, a resin substrate to which the hologram layer is adhered, and a holder portion that supports the resin substrate and has a thermal expansion coefficient smaller than that of the resin substrate. One of the holder portion and the resin substrate includes a contact surface along an axis extending in a plate thickness direction of the resin substrate, and the other of the holder portion and the resin substrate includes a pressing surface that presses the contact surface.