The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2023

Filed:

Dec. 19, 2018
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Fabrice Nemouchi, Moirans, FR;

Charles Baudot, Lumbin, FR;

Yann Bogumilowicz, Grenoble, FR;

Elodie Ghegin, Seyssinet-Pariset, FR;

Philippe Rodriguez, Le Grand-Lemps, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/13 (2006.01); G02B 6/122 (2006.01); H01L 21/02 (2006.01); H01L 33/00 (2010.01); G02B 6/12 (2006.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
G02B 6/131 (2013.01); G02B 6/1225 (2013.01); H01L 21/02639 (2013.01); H01L 21/02647 (2013.01); H01L 33/0066 (2013.01); H01L 33/0093 (2020.05); G02B 2006/1213 (2013.01); G02B 2006/12061 (2013.01); G02B 2006/12121 (2013.01); G02B 2006/12128 (2013.01); G02B 2006/12142 (2013.01); G02B 2006/12178 (2013.01); H01L 21/02381 (2013.01); H01L 21/02461 (2013.01); H01L 21/02538 (2013.01); H01L 25/0753 (2013.01);
Abstract

A process for fabricating a heterostructure includes at least one elementary structure made of III-V material on the surface of a silicon-based substrate successively comprising: producing a first pattern having at least a first opening in a dielectric material on the surface of a first silicon-based substrate; a first operation for epitaxy of at least one III-V material so as to define at least one elementary base layer made of III-V material in the at least first opening; producing a second pattern in a dielectric material so as to define at least a second opening having an overlap with the elementary base layer; a second operation for epitaxy of at least one III-V material on the surface of at least the elementary base layer made of III-V material(s) so as to produce the at least elementary structure made of III-V material(s) having an outer face; an operation for transferring and assembling the at least photonic active elementary structure via its outer face, on an interface that may comprise passive elements and/or active elements, the interface being produced on the surface of a second silicon-based substrate; removing the first silicon-based substrate and the at least elementary base layer located on the elementary structure.


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