The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2023
Filed:
Dec. 13, 2019
Corning Incorporated, Corning, NY (US);
Thomas William Brew, Corning, NY (US);
Yuehao Li, Painted Post, NY (US);
Min Shen, Horseheads, NY (US);
Corning Incorporated, Corning, NY (US);
Abstract
Methods of depositing an inorganic material on an extrusion die including positioning an extrusion die within a vapor deposition chamber, positioning an impedance disk over a face of the extrusion die, the impedance disk having a plurality of through holes and the face of the extrusion die having a plurality of slots defined by a plurality of extrusion die pins, and flowing one or more deposition gases through the plurality of through holes and into the plurality of slots to deposit inorganic particles on side walls of the plurality of pins. The total impedance to the flow of the deposition gases across the impedance disk and the extrusion die may be equal to a disk impedance of the impedance disk plus a die impedance of the extrusion die, and the disk impedance may be at least 40% of the total impedance to the flow of the deposition gases.