The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2023
Filed:
Oct. 15, 2020
Applicant:
Fujifilm Corporation, Tokyo, JP;
Inventors:
Kosuke Yamashita, Shizuoka, JP;
Kazuto Shimada, Shizuoka, JP;
Assignee:
FUJIFILM Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); C08K 3/04 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 3/34 (2006.01); C08K 3/38 (2006.01); C08K 7/04 (2006.01); C08K 9/02 (2006.01); H01L 23/373 (2006.01); G03F 7/32 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08K 3/042 (2017.05); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 3/34 (2013.01); C08K 3/38 (2013.01); C08K 7/04 (2013.01); C08K 9/02 (2013.01); H01L 23/3737 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2241 (2013.01); C08K 2003/282 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); C08K 2201/016 (2013.01); G03F 7/322 (2013.01);
Abstract
The present invention relates to a thermal conductive layer that includes at least one filler, has a thermal diffusivity of 5.0×10msor more, and has a volume resistivity of 1.0×10Ω·cm or more. Further, the present invention relates to a photosensitive layer to which the thermal conductive layer is applied, a photosensitive composition, a manufacturing method for a thermal conductive layer, and a laminate and a semiconductor device.