The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2023

Filed:

Jul. 07, 2020
Applicant:

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

Brian Deegan, Dublin, IE;

Darren Nolan, Dublin, IE;

Brendan Kneafsey, Dublin, IE;

Mark Loane, Dublin, IE;

Assignee:

Henkel AG & Co. KGaA, Duesseldorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 4/06 (2006.01); B29C 45/18 (2006.01); C08F 2/48 (2006.01); C08F 212/08 (2006.01); C08F 220/06 (2006.01); C08F 220/18 (2006.01); C08F 220/28 (2006.01); C09D 5/00 (2006.01); C09D 153/02 (2006.01); C08F 285/00 (2006.01); C08F 287/00 (2006.01); B29C 45/14 (2006.01); B29K 23/00 (2006.01); B29K 705/02 (2006.01); B29K 709/08 (2006.01);
U.S. Cl.
CPC ...
C09D 5/002 (2013.01); B29C 45/14311 (2013.01); C08F 220/281 (2020.02); C08F 285/00 (2013.01); C08F 287/00 (2013.01); C09D 4/06 (2013.01); C09D 153/025 (2013.01); B29K 2023/00 (2013.01); B29K 2705/02 (2013.01); B29K 2709/08 (2013.01); C08F 220/1811 (2020.02);
Abstract

A curable primer composition comprising:(a) a curable component such as methacrylate; (b) a cure initiating component; and (c) a polymer material selected from the group consisting of: (i) block polymers represented by S-A-S where S is polystyrene and A stands for a polymer or copolymer formed from one or more of ethylene, propylene, butylene, and styrene, which are optionally substituted with carboxylic acid or maleic anhydride; provided that when A comprises styrene then A is a copolymer of styrene with at least one of ethylene, propylene and butylene, and is optionally substituted with carboxylic acid or maleic anhydride; and (ii) polystyrene-poly(ethylene-propylene) ('SEP'); and (iii) any combination of said polymer materials. The composition is applied to a part then photocured. It is dry to touch. Thereafter a thermoplastic material such as a polyolefin is overmolded (e.g. injection molded) over the applied composition. It enhances bond strength of the polyolefin to the part.


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