The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2023
Filed:
Dec. 03, 2021
Applicant:
Aac Acoustic Technologies (Shenzhen) Co., Ltd., Shenzhen, CN;
Inventors:
Assignee:
AAC Acoustic Technologies (Shenzhen) Co., Ltd., Shenzhen, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01); B81B 7/02 (2006.01); B81B 3/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/02 (2013.01); B81B 3/0027 (2013.01); H04R 25/00 (2013.01); H04R 25/606 (2013.01); B81B 2201/0285 (2013.01);
Abstract
The present disclosure provides a bone-conduction sensor assembly. The bone-conduction sensor assembly includes a housing, a printed circuit board assembly forming a first receiving cavity together with the housing, a diaphragm accommodated in the first receiving cavity, a MEMS die and an ASIC chip mounted on the printed circuit board assembly. The MEMS die electrically connects to the ASIC chip through a bonding wire. A first weight is located on a surface of the diaphragm facing to the printed circuit board assembly. A position of the first weight has an avoiding portion corresponding to the bonding wire.