The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2023
Filed:
Mar. 13, 2020
Nitto Denko Corporation, Ibaraki, JP;
Ryota Mita, Ibaraki, JP;
Tomoaki Ichikawa, Ibaraki, JP;
NITTO DENKO CORPORATION, Ibaraki, JP;
Abstract
To provide a wound body of a sheet for sintering bonding with a base material that realizes a satisfactory operational efficiency in a process of producing a semiconductor device comprising sintering bonding portions of semiconductor chips and that also has both a satisfactory storage stability and a high storage efficiency. A wound bodyaccording to the present invention has a form in which a sheet for sintering bonding with a base material X is wound around a winding coreinto a roll shape, the sheet for sintering bonding with a base material X having a laminated structure comprising: a base material; and a sheet for sintering bonding, comprising an electrically conductive metal containing sinterable particle and a binder component.