The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2023
Filed:
Dec. 07, 2018
Nippon Steel Corporation, Tokyo, JP;
Nobuo Kadowaki, Tokyo, JP;
Kazushi Iwakiri, Tokyo, JP;
Tomohiro Mizutani, Tokyo, JP;
Satoshi Kato, Tokyo, JP;
NIPPON STEEL CORPORATION, Tokyo, JP;
Abstract
A heat sealed lid includes: a resin laminate aluminum foil; and a first seamed side frame portion and a second seamed side frame portion formed of a resin film laminate metal sheet, in which the resin film laminate metal sheet includes a metal sheet, a laminate film formed on one surface of the metal sheet, and a second resin film formed on the other surface of the metal sheet and containing a thermoplastic polyester resin, the laminate film includes an adhesion layer containing a polypropylene-based resin and a polyethylene-based resin and a base layer containing a modified polypropylene-based resin, an amount of the polyethylene-based resin in the adhesion layer is 1.0 mass % or more and 45.0 mass % or less of the resins of the adhesion layer, the melting point of the second resin film is higher than the melting point of the adhesion layer by 40° C. or more and is higher than the heating temperature of a heat sealing tool, the thickness of the adhesion layer is 1.0 μm or more and 15.0 μm or less, and the thickness of the base layer is 1.0 μm or more and 18.0 μm or less.