The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2023

Filed:

Jun. 01, 2018
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Krzysztof Nauka, Palo Alto, CA (US);

John Samuel Dilip Jangam, Palo Alto, CA (US);

Kristopher J. Erickson, Palo Alto, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 10/14 (2021.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 70/00 (2020.01); B22F 12/43 (2021.01); B22F 12/63 (2021.01); B22F 10/28 (2021.01); B22F 1/052 (2022.01); B22F 1/105 (2022.01); B22F 1/17 (2022.01); B33Y 70/10 (2020.01);
U.S. Cl.
CPC ...
B22F 1/17 (2022.01); B22F 1/052 (2022.01); B22F 1/105 (2022.01); B22F 10/14 (2021.01); B22F 10/28 (2021.01); B22F 12/43 (2021.01); B22F 12/63 (2021.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B22F 2301/35 (2013.01); B22F 2304/10 (2013.01); B33Y 70/00 (2014.12); B33Y 70/10 (2020.01);
Abstract

The present disclosure is drawn to a material set including a powder bed material and a binder fluid. The powder bed material can be from 80 wt % to 100 wt % metal particles having a metal core and a thin metal layer on the core, and the metal particles having a D50 particle size distribution value ranging from 4 μm to 150 μm and the thin metal layer having an average thickness from 20 nm to 2 μm. The binder fluid can adhere a first portion of the powder bed material relative to a second portion of the powder bed material not in contact with the binder fluid.


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