The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2023
Filed:
Mar. 23, 2022
Qing Ding Precision Electronics (Huaian) Co.,ltd, Huai an, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Jin-Cheng Wu, Huai an, CN;
Mei-Hua Huang, Shenzhen, CN;
Ning Hou, Shenzhen, CN;
Hua-Ning Wang, Shenzhen, CN;
Qiang Song, Shenzhen, CN;
Rong-Chao Li, Shenzhen, CN;
QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Huai an, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Abstract
A method for manufacturing a circuit board is disclosed. An inner wiring base board with a first opening is provided. A base board is fixed in the first opening, and a first wiring base board and a second wiring base board are pressed on opposite surfaces of the inner wiring base board. The base board is made of ceramic and has a high light reflectivity of 92% to 97%. A first conductor layer and a second conductor layer are formed on opposite surfaces of the laminated structure. The first conductor layer includes a plurality of connecting pads on the base board. A solder mask is formed on an outer side of the first conductor layer, the solder mask has a high light reflectivity of 92% to 95%, and the base board is exposed outside the solder mask.