The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2023

Filed:

Nov. 20, 2020
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Jeahyeong Han, San Diego, CA (US);

Suhyung Hwang, Rancho Mission Viejo, CA (US);

Mina Iskander, San Diego, CA (US);

Rajneesh Kumar, San Diego, CA (US);

Darryl Sheldon Jessie, San Diego, CA (US);

Assignee:

QUALCOMM INCORPORATED, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 1/52 (2006.01); H01Q 21/29 (2006.01); H01Q 23/00 (2006.01); H05K 1/02 (2006.01); H01Q 1/48 (2006.01); H01Q 21/06 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0219 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/48 (2013.01); H01Q 1/526 (2013.01); H01Q 21/061 (2013.01); H05K 1/0225 (2013.01); H05K 1/0227 (2013.01); H05K 1/0278 (2013.01); H01Q 21/29 (2013.01); H01Q 23/00 (2013.01); H05K 1/181 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/09681 (2013.01); H05K 2201/10098 (2013.01);
Abstract

Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.


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