The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2023

Filed:

Nov. 15, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Yibing Michelle Wang, Temple City, CA (US);

Radwanul Hasan Siddique, Pasadena, CA (US);

Kwang Oh Kim, Cerritos, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 23/45 (2023.01); H04N 23/55 (2023.01); H04N 23/80 (2023.01);
U.S. Cl.
CPC ...
H04N 23/45 (2023.01); H04N 23/55 (2023.01); H04N 23/80 (2023.01);
Abstract

A camera system includes two or more sensor arrays and an optical path. The sensor arrays are on the same sensor chip. Each sensor array includes the same field of view (FOV) as each other sensor array. The optical path includes a main lens and a metalens that are shared by each sensor array, and a microlens associated with each sensor array. The metalens splits incident light into different spectrums of light and directs each respective spectrum to a corresponding sensor array. The different spectrums of light include at least two of visible light, near infrared light, shortwave infrared and longwave infrared, and at least one sensor array includes single-photon avalanche diodes. The image processor that provides image processing, object recognition and object tracking and/or image fusion functionality may be on the same sensor chip as the sensor arrays.


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