The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2023
Filed:
Jan. 14, 2020
Tyco Electronics Raychem Gmbh, Ottobrunn, DE;
Thilo Simonsohn, Munich, DE;
Christian Heindl, Munich, DE;
Tyco Electronics Raychem GmbH, Ottobrunn, DE;
Abstract
A heat shrink component includes a heat shrink layer and a heating unit in thermal contact with at least a part of the heat shrink layer and heating the heat shrink layer to a heat shrink temperature. The heat shrink component has a first dimension in an expanded state and a second dimension in a shrunk state after heating, the first dimension is larger than the second dimension. The heating unit includes an electrically conductive lead heated by an electrical current flowing through the electrically conductive lead and a heat spreading layer arranged in thermal contact with the electrically conductive lead and distributing a heat generated by the electrically conductive lead.