The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2023

Filed:

Nov. 05, 2020
Applicant:

Nichia Corporation, Anan, JP;

Inventor:

Tomokazu Taji, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/40 (2006.01); H01S 5/00 (2006.01); H01S 5/30 (2006.01); G01R 31/44 (2020.01); G01R 31/26 (2020.01); H01S 5/0237 (2021.01); H01S 5/02255 (2021.01); H01S 5/02257 (2021.01); H01S 5/02208 (2021.01); H01S 5/02325 (2021.01); H01S 5/02345 (2021.01);
U.S. Cl.
CPC ...
H01S 5/4018 (2013.01); G01R 31/2601 (2013.01); G01R 31/2635 (2013.01); G01R 31/44 (2013.01); H01S 5/0014 (2013.01); H01S 5/0087 (2021.01); H01S 5/0237 (2021.01); H01S 5/02255 (2021.01); H01S 5/02257 (2021.01); H01S 5/3013 (2013.01); H01S 5/005 (2013.01); H01S 5/0071 (2013.01); H01S 5/02208 (2013.01); H01S 5/02325 (2021.01); H01S 5/02345 (2021.01); H01S 5/4031 (2013.01);
Abstract

A light emitting device includes: a base comprising a first wiring, a second wiring, and a third wiring; a first semiconductor laser element electrically connected to the first wiring and the second wiring, at an upper surface side of the base; a second semiconductor laser element electrically connected to the second wiring and the third wiring, at the upper surface side of the base; and a base cap fixed to the base such that the first semiconductor laser element and the second semiconductor laser element are enclosed in a space defined by the base and the base cap. The first semiconductor laser element and the second semiconductor laser element are connected in series. A portion of each of the first, second, and third wirings is exposed at the upper surface of the base at locations outside of the space defined by the base and the base cap.


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