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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11695125 B1

PDFFull Text
Date of Patent:
Jul. 04, 2023

Filed:

Jul. 17, 2018

Deposition on two sides of a web

Applicant:

Amprius Technologies, Inc., Fremont, CA (US);

Inventors:

Ronald J. Mosso, Fremont, CA (US);

Ghyrn E. Loveness, Mountain View, CA (US);

Assignee:

AMPRIUS TECHNOLOGIES, INC., Fremont, CA (US);

Attorney:

Weaver Austin Villeneuve & Sampson LLP

Primary Examiner:

Kelly M Gambetta

Int. Cl.
CPC ...
H01M 6/40 (2006.01); H01M 4/04 (2006.01); H01M 4/139 (2010.01); H01M 4/38 (2006.01); B05D 1/00 (2006.01); H01M 4/36 (2006.01); B82Y 40/00 (2011.01); C23C 16/02 (2006.01); C23C 16/52 (2006.01); C23C 16/54 (2006.01); C23C 16/56 (2006.01); C23C 16/04 (2006.01); C23C 16/22 (2006.01); C23C 16/24 (2006.01); C23C 16/26 (2006.01); C23C 16/42 (2006.01);
U.S. Cl.
CPC ...
H01M 6/40 (2013.01); C23C 16/0209 (2013.01); C23C 16/0272 (2013.01); C23C 16/042 (2013.01); C23C 16/22 (2013.01); C23C 16/24 (2013.01); C23C 16/26 (2013.01); C23C 16/42 (2013.01); C23C 16/52 (2013.01); C23C 16/545 (2013.01); C23C 16/56 (2013.01); H01M 4/0421 (2013.01); H01M 4/139 (2013.01); H01M 4/386 (2013.01); B05D 1/62 (2013.01); B05D 2252/02 (2013.01); B05D 2252/10 (2013.01); B82Y 40/00 (2013.01); H01M 4/366 (2013.01); Y10S 977/843 (2013.01); Y10S 977/897 (2013.01);
Abstract

Apparatuses and methods for depositing materials on both sides of a web while it passes a substantially vertical direction are provided. In particular embodiments, a web does not contact any hardware components during the deposition. A web may be supported before and after the deposition chamber but not inside the deposition chamber. At such support points, the web may be exposed to different conditions (e.g., temperature) than during the deposition. Also provided are substrates having materials deposited on both sides that may be fabricated by the methods and apparatuses.

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