The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2023

Filed:

Jan. 20, 2022
Applicant:

Socionext Inc., Kanagawa, JP;

Inventors:

Takumi Ihara, Yokohama, JP;

Masanori Natsuaki, Yokohama, JP;

Assignee:

SOCIONEXT INC., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 23/49827 (2013.01); H01L 24/48 (2013.01);
Abstract

A semiconductor device includes a wiring board, a semiconductor chip arranged on the wiring board, and a plurality of bumps arranged between the wiring board and the semiconductor chip, wherein the wiring board includes a first conductor, a second conductor, a third conductor, a first via, a second via, and a third via, wherein the second conductor is arranged at a position closer to a center of the semiconductor chip than the first conductor is to the center, as seen in a thickness direction, the first conductor and the second conductor are arranged next to each other without another conductor interposed therebetween, as seen in the thickness direction, and a first distance between the first conductor and the second conductor is larger than a second distance between the first conductor and the third conductor.


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