The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2023
Filed:
May. 03, 2019
Princeton Infrared Technologies, Inc., Monmouth Junction, NJ (US);
Martin H Ettenberg, Princeton, NJ (US);
Michael Lange, Newtown, PA (US);
Princeton Infrared Technologies, Inc., Monmouth Junction, NJ (US);
Abstract
The disclosed technique may be used to electrically and physically connect semiconductor wafers. The wafer may utilize a thick dielectric. Indium bumps may be deposited and patterned in a dielectric film with a small diameter, tall height and substantially uniform in size and shape. The indium can be melted to create small grain size and uniform height bumps. The dielectric film may feature trenches around the indium bumps to prevent shorting of pixels when pressed together.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile