The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2023

Filed:

Mar. 24, 2021
Applicant:

Silanna Asia Pte Ltd, Singapore, SG;

Inventors:

Ariel Tan, Langkaan Dasmarirnas Cavite, PH;

Ren Huei Tzeng, San Diego, CA (US);

Assignee:

Silanna Asia Pte Ltd, Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/28 (2006.01); H01L 21/56 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4951 (2013.01); H01L 21/56 (2013.01); H01L 23/28 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 2021/6027 (2013.01);
Abstract

Disclosed is a device including a first finger of a plurality of lead fingers of a lead frame connected to a first flag. A second finger of the plurality of lead fingers of the lead frame is connected to a second flag. A semiconductor die is coupled to the lead frame. An encapsulant covers the semiconductor die, the lead frame, and a first end of the plurality of lead fingers, and excludes the first flag and the second flag. The first flag and the second flag are separated and electrically isolated from one another by the encapsulant.


Find Patent Forward Citations

Tan, Ariel. (2023). Lead frame package having conductive surfaces (U.S. Patent No. 11694945). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11694945

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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