The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2023
Filed:
Mar. 21, 2017
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Dongming Iu, Union City, CA (US);
Mehran Behdjat, San Jose, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01J 37/32 (2006.01); H01L 21/67 (2006.01); G05D 7/06 (2006.01); G05D 16/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); G05D 7/0635 (2013.01); G05D 16/2013 (2013.01); H01J 37/32009 (2013.01); H01J 37/3244 (2013.01); H01J 37/32715 (2013.01); H01L 21/67253 (2013.01); H01L 21/67259 (2013.01); H01L 21/67288 (2013.01);
Abstract
Implementations described herein relate to pressure control for vacuum chuck substrate supports. In one implementation, a process chamber defines a process volume and a vacuum chuck support is disposed within the process volume. A pressure controller is disposed on a fluid flow path upstream from the vacuum chuck and a flow restrictor is disposed on the fluid flow path downstream from the vacuum chuck. Each of the pressure controller and flow restrictor are in fluid communication with a control volume of the vacuum chuck.