The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2023

Filed:

May. 25, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Jean Delmas, Santa Clara, CA (US);

Steven Verhaverbeke, San Francisco, CA (US);

Kurtis Leschkies, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); F27B 9/36 (2006.01); H01L 21/677 (2006.01); H01L 21/324 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67109 (2013.01); F27B 9/36 (2013.01); H01L 21/324 (2013.01); H01L 21/67017 (2013.01); H01L 21/6719 (2013.01); H01L 21/67248 (2013.01); H01L 21/67754 (2013.01); H01L 21/67748 (2013.01);
Abstract

Embodiments of the disclosure relate to an apparatus and method for annealing one or more semiconductor substrates. In one embodiment, a processing chamber is disclosed. The processing chamber includes a chamber body enclosing an internal volume, a substrate support disposed in the internal volume and configured to support a substrate during processing, a gas panel configured to provide a processing fluid into the internal volume, and a temperature-controlled fluid circuit configured to maintain the processing fluid at a temperature above a condensation point of the processing fluid. The temperature-controlled fluid circuit includes a gas conduit fluidly coupled to a port on the chamber body at a first end and to the gas panel at a second end.


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