The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2023
Filed:
Nov. 02, 2018
Hitachi, Ltd., Tokyo, JP;
Motomune Kodama, Tokyo, JP;
Hideki Tanaka, Tokyo, JP;
Takaaki Suzuki, Tokyo, JP;
Hiroshi Kotaki, Tokyo, JP;
HITACHI, LTD., Tokyo, JP;
Abstract
The purpose of the present invention is to provide a method for causing sufficient deformation in precursor particles even when a soft high-purity metal is used for an outer layer material in mechanical milling, and manufacturing an MgBsuperconducting wire. A method for manufacturing an MgBsuperconducting wire in which an MgBfilament is covered by an outer layer material, the method comprising: subjecting magnesium powder and boron powder to a shock that is insufficient for MgBto be clearly produced, and producing precursor particles in which boron particles are dispersed inside a magnesium matrix; filling a metal tub with the precursor particles; processing the metal tube filled with precursor particles to form a wire; and heat-treating the wire to synthesize the MgB; wherein the method is characterized in that a portion of the wire-drawing step includes swaging.