The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2023

Filed:

May. 27, 2020
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Curtis B. Carlsten, Seekonk, RI (US);

Frederick B. Koehler, Tucson, AZ (US);

Jason E. Gaudette, Portsmouth, RI (US);

Peter M. Willey, Rumford, RI (US);

Assignee:

Raytheon Company, Waltham, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G10K 11/00 (2006.01); H04B 11/00 (2006.01); B63B 22/00 (2006.01);
U.S. Cl.
CPC ...
G10K 11/006 (2013.01); H04B 11/00 (2013.01); B63B 22/003 (2013.01);
Abstract

A deployment module according to the present application enables both compact stowage of a sensor array and expansion of the sensor array into a three-dimensional volumetric array shape that enables improved directionality of the sensors during operation. The deployment module includes a support shell that is configured to retain a cable of the sensor array separately from sensors of the sensor array and an expandable deployment body formed of a superelastic shape memory alloy that uses superelasticity and stored energy for deployment of the sensor array. During deployment, the deployment body is removed from the support shell and the sensors are subsequently pulled out of the support shell. The deployment body then expands and holds the cable to retain the three-dimensional volumetric shape of the deployed array.


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