The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2023
Filed:
Apr. 19, 2019
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventor:
Keiji Yamashita, Utsunomiya, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); H01L 21/0274 (2013.01);
Abstract
A molding apparatus for molding a composition on a substrate using a mold includes a moving unit configured to hold and move the substrate and a gaseous matter supplying unit configured to supply gaseous matter. The gaseous matter supplying unit includes a supply port arranged in a periphery of the substrate held by the moving unit, and supplies the gaseous matter from the supply port while the moving unit is moving the substrate after the composite is supplied to the molding area in the periphery of the substrate.