The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2023
Filed:
Jul. 02, 2021
Tessandra Anne Sage, Long Beach, NY (US);
Stanley Katsuyoshi Wakamiya, Ellicott City, MD (US);
Jonathan Francis Van Dyke, East Elmhurst, NY (US);
Kevin Collao, Rosedale, MD (US);
Joshua P. Osborne, Ellicott City, MD (US);
Tessandra Anne Sage, Long Beach, NY (US);
Stanley Katsuyoshi Wakamiya, Ellicott City, MD (US);
Jonathan Francis Van Dyke, East Elmhurst, NY (US);
Kevin Collao, Rosedale, MD (US);
Joshua P. Osborne, Ellicott City, MD (US);
NORTHROP GRUMMAN SYSTEMS CORPORATION, Falls Church, VA (US);
Abstract
One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober.