The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2023

Filed:

Mar. 30, 2021
Applicant:

Rosemount Aerospace Inc., Burnsville, MN (US);

Inventors:

David P. Potasek, Lakeville, MN (US);

Jun Zheng, Edina, MN (US);

Assignee:

ROSEMOUNT AEROSPACE INC., Burnsville, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 13/02 (2006.01); G01L 9/00 (2006.01); G01L 19/14 (2006.01); G01F 1/36 (2006.01); G01L 27/00 (2006.01);
U.S. Cl.
CPC ...
G01L 13/026 (2013.01); G01F 1/36 (2013.01); G01L 9/0048 (2013.01); G01L 13/025 (2013.01); G01L 19/142 (2013.01); G01L 19/145 (2013.01); G01L 27/005 (2013.01);
Abstract

A differential MEMS pressure sensor includes a topping wafer with a top side and a bottom side, a diaphragm wafer having a top side connected to the bottom side of the topping wafer and a bottom side, and a backing wafer having a top side connected to the bottom side of the diaphragm wafer and a bottom side. The topping wafer includes a first cavity formed in the bottom side of the topping wafer. The diaphragm wafer includes a diaphragm, a second cavity formed in the bottom side of the diaphragm wafer underneath the diaphragm, an outer portion surrounding the diaphragm, and a trench formed in the top side of the diaphragm wafer and positioned in the outer portion surrounding the diaphragm.


Find Patent Forward Citations

Loading…