The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2023
Filed:
Mar. 15, 2021
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Shunsuke Akasaka, Kyoto, JP;
Yurina Amamoto, Kyoto, JP;
Keisuke Wakamoto, Kyoto, JP;
Ken Nakahara, Kyoto, JP;
Assignee:
ROHM Co., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F 1/69 (2006.01);
U.S. Cl.
CPC ...
G01F 1/69 (2013.01);
Abstract
Disclosed is a thermal flow sensor including a base member and a cover. The base member includes a heater. The cover is formed by an SOI substrate including a silicon substrate, a silicon dioxide film, and a silicon film. The silicon film has a recessed portion defined therein. A main flow passage portion is defined by an exposed surface of the silicon dioxide film which is exposed from the silicon film and which defines a bottom surface of the recessed portion, the silicon film defining a side surface of the recessed portion, and a first principal surface of the cover.