The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2023

Filed:

Dec. 17, 2019
Applicant:

Showa Denko K.k., Tokyo, JP;

Inventors:

Yoshikazu Umeta, Chichibu, JP;

Yoshishige Okuno, Chiba, JP;

Rimpei Kindaichi, Chiba, JP;

Assignee:

SHOWA DENKO K.K., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01); C30B 25/14 (2006.01); C30B 25/12 (2006.01); H01L 21/02 (2006.01); C23C 16/32 (2006.01); C23C 16/46 (2006.01); C30B 29/36 (2006.01); H01L 21/205 (2006.01);
U.S. Cl.
CPC ...
C23C 16/455 (2013.01); C23C 16/325 (2013.01); C23C 16/46 (2013.01); C30B 25/12 (2013.01); C30B 25/14 (2013.01); C30B 29/36 (2013.01); H01L 21/02529 (2013.01); H01L 21/205 (2013.01);
Abstract

Provided is a SiC chemical vapor deposition apparatus including: a furnace body inside of which a growth space is formed; and a placement table which is positioned in the growth space and has a placement surface on which a SiC wafer is placed, in which the furnace body comprises a first hole which is positioned on an upper portion which faces the placement surface and through which a raw material gas is introduced into the growth space, a second hole which is positioned on a side wall of the furnace body and through which a purge gas flows into the growth space, a third hole which is positioned on the side wall of the furnace body at a lower position than the second hole and discharges the gases in the growth space, and a protrusion which is protrudes towards the growth space from a lower end of the second hole to adjust a flow of the raw material gas.


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