The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2023

Filed:

Oct. 03, 2019
Applicant:

C-tec Constellium Technology Center, Voreppe, FR;

Inventor:

Bechir Chehab, Voiron, FR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 1/00 (2023.01); B33Y 70/00 (2020.01); B22F 10/00 (2021.01); C22C 1/04 (2023.01); B33Y 40/20 (2020.01); C22C 21/00 (2006.01); B22F 10/64 (2021.01); B22F 12/41 (2021.01); B22F 10/28 (2021.01); C21D 1/18 (2006.01); C22F 1/04 (2006.01); B22F 10/22 (2021.01); B22F 10/25 (2021.01); B22F 1/00 (2022.01); B22F 3/24 (2006.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
C22C 1/0416 (2013.01); B22F 1/00 (2013.01); B22F 10/22 (2021.01); B22F 10/25 (2021.01); B22F 10/28 (2021.01); B22F 10/64 (2021.01); B22F 12/41 (2021.01); B33Y 40/20 (2020.01); B33Y 70/00 (2014.12); C21D 1/18 (2013.01); C22C 21/00 (2013.01); C22C 21/003 (2013.01); C22F 1/04 (2013.01); B22F 2003/248 (2013.01); B22F 2301/052 (2013.01); B22F 2301/205 (2013.01); B22F 2301/35 (2013.01); B22F 2998/10 (2013.01); B33Y 10/00 (2014.12);
Abstract

The invention relates to a process for manufacturing a part comprising a formation of successive solid metal layers () that are stacked on top of one another, each layer describing a pattern defined using a numerical model (M), each layer being formed by the deposition of a metal (), referred to as solder, the solder being subjected to an input of energy so as to start to melt and to constitute, by solidifying, said layer, wherein the solder takes the form of a powder (), the exposure of which to an energy beam () results in melting followed by solidification so as to form a solid layer (). The process is characterized in that the solder () is an aluminum alloy comprising at least the following alloy elements: —Fe, in a weight fraction of from 1 to 3.7%, preferably from 1 to 3.6%; —Zr and/or Hf and/or Er and/or Sc and/or Ti, in a weight fraction of from 0.5 to 4%, preferably from 1 to 4%, more preferably from 1.5 to 3.5%, even more preferably from 1.5 to 2% each, and in a weight fraction of less than or equal to 4%, preferably less than or equal to 3%, more preferably less than or equal to 2% in total; —Si, in a weight fraction of from 0 to 4%, preferably from 0.5 to 3%; —V, in a weight fraction of from 0 to 4%, preferably from 0.5 to 3%. The invention also relates to a part obtained by this process. The alloy used in the additive manufacturing process according to the invention makes it possible to obtain parts having remarkable features.


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