The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2023

Filed:

Jun. 29, 2022
Applicant:

Ube Corporation, Ube, JP;

Inventors:

Yuya Miki, Ube, JP;

Tetsuro Hiroki, Ube, JP;

Masayoshi Baba, Ube, JP;

Assignee:

UBE CORPORATION, Ube, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 77/06 (2006.01);
U.S. Cl.
CPC ...
C08L 77/06 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01);
Abstract

A polyamide resin composition having excellent low-temperature impact resistance and surface property, a polyamide resin composition for rotational molding and a rotational molded article using the same. The polyamide resin composition includes a component (A) in an amount of a parts by weight, which is an aliphatic polyamide having a relative viscosity ηr of less than 2.6 as measured according to JIS K6920 under the conditions of 96 wt % of sulfuric acid, 1 wt % of the polymer concentration, and 25° C.; a component (B) in an amount of b parts by weight, which is a modified polyolefin having a density of 0.895 g/cmor less as measured according to ASTM D1505; and a component (C) in an amount of c parts by weight, which is a non-modified polyolefin having an MFR value of 3.0 to 30 g/10 min as measured in a load of 2.16 kg at 190° C., and the polyamide resin composition satisfies the following equations: 50≤c/(b+c)×100≤70, and 10≤(b+c)/(a+b+c)×100≤40.


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