The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2023

Filed:

Aug. 08, 2018
Applicant:

Clariant Plastics & Coatings Ltd, Muttenz, CH;

Inventors:

Harald Bauer, Kerpen, DE;

Sebastian Hörold, Diedorf, DE;

Martin Sicken, Cologne, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 77/06 (2006.01); C08G 69/26 (2006.01); C08K 3/40 (2006.01); C08K 5/52 (2006.01); C08K 5/524 (2006.01); C08K 5/5313 (2006.01); C08K 5/5333 (2006.01); C08K 7/14 (2006.01); C08K 13/04 (2006.01);
U.S. Cl.
CPC ...
C08L 77/06 (2013.01); C08G 69/26 (2013.01); C08K 3/40 (2013.01); C08K 5/524 (2013.01); C08K 5/5205 (2013.01); C08K 5/5313 (2013.01); C08K 5/5333 (2013.01); C08K 7/14 (2013.01); C08K 13/04 (2013.01); C08K 2201/014 (2013.01); C08L 2201/02 (2013.01); C08L 2205/025 (2013.01);
Abstract

A flame-retardant polyamide composition can be prepared with a glow wire ignition temperature of not less than 775° C. Such a composition can include a polyamide having a melting point of not more than 290° C. as component A, fillers and/or reinforcers as component B, a phosphinic salt of the formula (I) as component C, a compound selected from the group of the Al, Fe, TiOand Zn salts of ethylbutylphosphinic acid, of dibutylphosphinic acid, of ethylhexylphosphinic acid, of butylhexylphosphinic acid and/or of dihexylphosphinic acid as component D, a phosphonic salt of the formula (II) as component E, and a melamine polyphosphate having an average degree of condensation of 2 to 200 as component F. Additional components can be included in the composition.


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